Electrostatic adsorption of dust has a great impact on the microelectronics industry. In the production of modern large-scale integrated circuits (LSI), the line spacing of the chips is very small. If it produces electrostatic adsorption of a few to tens of microns of dust is obvious. A diameter of a few microns of dust adsorption on the chip, can cause dozens of core wire insulation between the strength of the reduction, so that the chip leakage current increases, the service life is shortened, and even quickly caused by a short circuit so that the chip is damaged. Due to electrostatic adsorption of dust, especially for photoelectric devices (CCD, LED, photovoltaic cells, etc.), its conversion efficiency will be greatly reduced. As shown in Figure 1-10 for the comparison of dust particle size and IC chip spacing. Acid, alkali, silicon and other microparticles adsorbed on the chip, can also cause chip corrosion.