Project Background

In the whole process of electronic substrate assembly, the core processes such as substrate handling, component bonding and welding are prone to generate static electricity due to material friction and component peeling, which in turn leads to a series of key problems affecting production efficiency and product quality and becomes a common pain point faced by the industry: charged electronic substrates will strongly absorb dust and metal debris in the air. Once these impurities are attached to precision parts such as pads and chip pins, directly lead to welding virtual welding, poor circuit contact and other defects, more likely to breakdown the core precision components, resulting in a significant increase in the defective rate of finished products; Electrostatic electricity will also cause adhesion between the substrate and conveying equipment and tooling, causing production failures such as feeding jam and positioning deviation, forcing the equipment to stop and adjust, and seriously affecting the production line. In addition, when the charged substrate enters the subsequent packaging process, it is easy to adsorb environmental impurities, this results in quality defects such as bubbles in the packaging colloid and poor bonding between the substrate and the colloid, significantly increasing the cost of rework and the risk of customer complaints.

Solution

In view of the electrostatic and impurity problems of electronic substrate assembly, the electrostatic ion dust box is used as the core processing equipment, and is accurately deployed at the key nodes of the production line, so as to realize the synchronous and efficient completion of electrostatic elimination and substrate cleaning, and solve the quality hidden danger from the source.

The specific implementation scheme is as follows: in the three key stations of the electronic substrate assembly production line-after the substrate is transported, before welding and before packaging, the special electrostatic ion dust removal box for the electronic substrate is accurately deployed, and the electronic substrate to be processed is automatically fed into the dust removal box through the production line conveyor belt. The electrostatic ion dust removal box is equipped with multiple sets of high-performance ion generating devices, which can quickly release equal amounts of balanced positive and negative ions, instantly neutralize electrostatic charges on the surface of the electronic substrate, and completely eliminate electrostatic adsorption. At the same time, the equipment is equipped with a customized high-pressure airflow purging system, which purges the substrate surface in all directions through multi-angle airflow nozzles to completely blow away dust, metal debris and other impurities that have lost electrostatic adsorption.